Investigation of Thermal Mapping Methods
نویسنده
چکیده
The reliability of an integrated circuit (IC) is a strong function of temperature. In this study, we developed domputer-aided design tools to predict the temperature distribution of an IC die and compared it with thermal maps obtained by infrared (IR) imaging. A temperature sensor array fabricated on test chips was used to measure the actual surface temperature of an IC die., This array was used to validate'the data obtained by IR imaging.
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